CC3200 Release Notes
Note: This wiki page is not longer maintained for updates. For the most recent release notes, please see the SDK tool download page on TI.com: http://www.ti.com/tool/download/CC3200SDK
This page describes the CC3200 Software Development Kit (SDK) and Service Pack Release packages. These releases shall be used only with CC3200 devices specified as below.
Service Pack Release
|Service Pack Version||Release Date||Release Notes||Device||Service Pack Download|
|126.96.36.199-188.8.131.52||Mar 27th, 2017||CC3200R1||Service Pack download|
|SDK Version||Release Date||Release Notes||Device||Device Version||Host Platform||Minimum IDE||Other Minimum Software||SDK Download|
|SDK 1.3.0||Feb 27th, 2017||CC3200||CC3200R1||
CC32xx SDK Sample Applications
Visit the CC3200 SDK Sample Application wiki page for a summary and user guides of each application included in the latest release.
- Latest: CC32xx Release Notes 1.3.0
- CC32xx Release Notes 1.2.0
- CC32xx Release Notes 1.1.0
- CC32xx Release Notes 1.0.0
- CC32xx Release Notes 0.5.2
- CC32xx Release Notes 0.5.1
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE–SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, the customer to minimize inherent or procedural hazards must provide adequate design and operating safeguards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.