CC32xx Release Notes

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Introduction

This page describes the CC3200 Software Development Kit (SDK) and Service Pack Release packages. These releases shall be used only with CC3200 devices specified as below.

Service Pack Release

Service Pack Version Release Date Release Notes Device Service Pack Download
1.0.1.11-2.9.0.0 Mar 27th, 2017 CC3200R1 Service Pack download


SDK Release

SDK Version Release Date Release Notes Device Device Version Host Platform Minimum IDE Other Minimum Software SDK Download
SDK 1.3.0 Feb 27th, 2017 CC3200 CC3200R1
  • CC3200-LAUNCHXL Rev3.2 and onwards
  • IAR v7.30.4.8187 for ARM
  • CCS v6.1.1.00022
  • CGT for CCS v5.2.6
  • TI-RTOS v2.15.0.17
  • FreeRTOS v8.0.1
SDK download

CC32xx SDK Sample Applications

Visit the CC3200 SDK Sample Application wiki page for a summary and user guides of each application included in the latest release.

Release History

Links

Important Notice

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TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.

CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE–SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.

In order to minimize risks associated with the customer’s applications, the customer to minimize inherent or procedural hazards must provide adequate design and operating safeguards.

TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.