Memory Vendor Selection Guide

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Sitara Memory Package options

For the Sitara product line there are several different options for memory packages.  We currently support PoP memory packages on the OMAP35x and the AM/DM37x devices.  These 2 devices also have a non-PoP discrete memory option.  All other devices support discrete memories only.  Below is a list of the current memory options:

  • AM17x - Discrete only
  • AM18x - Discrete only
  • OMAP35x - PoP and Discrete 
    • CBB package - 168 ball 12x12 PoP memories
      • DRAM - PoP or discrete. All SDRC signals are on both top and bottom balls
      • Flash - PoP or discrete - All GPMC signals are on both top and bottom balls
    • CBC packag - 152 ball 14x14 PoP memories
      • DRAM - PoP only. SDRC signals occur only on top balls
      • Flash - PoP or discrete - top balls do not have A[10:1] (PoP only supports mux mode) 
    • CUS package - Discrete Only
  • AM35x - Discrete only
  • AM/DM37x - PoP and Discrete
    • CBP package - 168 ball 12x12 PoP memories
      • DRAM - PoP only. SDRC signals occur only on top balls
      • Flash - PoP or discrete - All GPMC signals are on both top and bottom balls
    • CBC package - 152 ball 14x14 PoP memories
      • DRAM - PoP only. SDRC signals occur only on top balls
      • Flash - PoP or discrete - top balls do not have A[11:1] (PoP only supports mux mode)
    • CUS package - Discrete Only
  • AM335x - Discrete only
    • ZCE Package - Discrete
    • ZCZ Package - Discrete
  • AM437 - Discrete only


Device DRAM Flash
Discrete PoP Discrete PoP
AM17x ZKB ZKB
AM18x ZCE ZCE
OMAP35x CUS/CBB CBB/CBC CUS/CBB/CBC CBB/CBC
AM35x ZCN/ZER ZCN/ZER
AM/DM37x CUS CBP/CBC CUS/CBP/CBC CBP/CBC
AM335x ZCE ZCE
ZCZ ZCZ
AM437x ZDN ZDN

 


DRAM Selection

To choose the proper DRAM for your application you need to first determine what is supported by your processor.  You will need to consider the following:

  • What type of DRAM does the processor support
  • What is the Bus Width of the interface
  • What is the Clock Speed
  • Does the Processor support the density required for your application


 

Below is a list of supported DRAM types by device:

Device Memory Type Bus Width Max Clock Speed CAS Latencies

Max Addressable
space per CS

Number of CS

Total Addressable
Space *

AM17x SDR 16/32b 133MHz   2Gb 1 2Gb
AM18x LPDDR1 16b 150MHz 2, 3 2Gb 1 2Gb
DDR2 156MHz 2, 3, 4, 5 4Gb 4Gb
OMAP35x LPDDR1 16/32b 166MHz 1, 2, 3, 4, 5 4Gb 2 8Gb
AM35x LPDDR1 16/32b 166MHz 2, 3 4Gb 2 8Gb
DDR2 2, 3, 4, 5
AM/DM37x LPDDR1 16/32b 200MHz 1, 2, 3, 4, 5 4Gb 2 8Gb
AM335x LPDDR1 16b 200MHz 2, 3, 4 8Gb 1 8Gb
DDR2 266MHz 3, 4, 5, 6, 7
DDR3/L 400MHz 5, 6, 7, 8, 9, 10, 11
AM437x LPDDR2 32b 266MHz 3, 4, 5, 6, 7, 8 8Gb 2 16Gb
DDR3/L 400MHz 5, 6, 7, 8, 9, 10, 11

NOTE:*  the maximum load allowed for the DDR interface is 2 Dies.  Currently, the largest monolithic LPDDR1 device is 2Gb so for the LPDDR1 controllers you may be limited on the density based on this.

 

NAND Flash Selection

To choose a proper NAND Flash device for your application you need to determine what is supported by your processor.

  • Does the processor support Asynchronous, Synchronous, or both
  • What is the bus width of the interface
  • What is the clock speed
  • What density does your system require
  • How many bits of ECC does the Flash require
  • What is the page size of the memory


Please see the links below to help designing NAND devices with TI Processors:

NAND Compatibility

Raw NAND ECC

Managed NAND

PoP Memories

The OMAP35x and AM37x devices have some packages that must use PoP memories.  When designing with PoP memories please ensure that you have secured memories for the lifetime of your system. 

  • What is the lifetime of the system and will the memory be available for the entire life
  • Should the PoP memory be an MCP with both DRAM and Flash
    • Is the MCP with the needed density for both DRAM and Flash available
  • Same considerations as above for NAND and DRAM



Memory Vendors

There are many different memory vendors.  Below is a list of some of the vendors that TI communicates with regularly.  While we will continue to update this periodically please keep in mind that the memory industry moves very quickly and it is always best to contact the manufacturer or distributor to determine the proper part numbers and availability.  Please click the links below to see the parts that are currently available. 

Vendor DRAM Flash PoP Contact
Micron Yes Yes Yes - MCP available

Distributors and Sales Reps

Product Longevity Program

Microsemi Yes Yes Yes - MCP available Product info and Sales contact
Hynix Yes Yes Yes - MCP available

Smith and Associates -
PH: 1 800-468-7866
Email: houston@nfsmith.com 

Samsung Yes Yes Yes - MCP available Distributors
Elpida Yes No Yes - DRAM only

Sales offices

Toshiba No Yes Yes - They buy from other DRAM vendor Sales Contacts
ISSI Yes No No

Distributors

Spansion No Yes No Sales Reps and Distributors