OMAP35x CBC package pinlist

From Texas Instruments Embedded Processors Wiki

Care must be taken when designing with the CBC package as some signals are dual-role and some are feedthrough signals. Also, you must be aware of the pinout of the POP memory that you are using. Because these pinouts may be different for different POP memories, you must ensure that the signals on the memory match the signals on top side of the OMAP35x package.

Please read the following description on how to use this spreadsheet:

Contents 1 Glossary 2 Columns and Rows 3 Reading the Spreadsheet 3.1 Signals labeled POP-XXX

Glossary

• Ball and pin may be used interchangably below.
• Feedthrough signals describe top and bottom balls that are connected together in the CBC package. These are typically used to get a signal (or power) from the board, up through OMAP35x, to the top of the package where the POP memory sits. There is no other connection to the silicon, they just connect top and bottom balls.

Columns and Rows

The following columns are relevant:

• REFDES:
  • BGA (Ball Grid Array) describes a ball on the bottom side of the package (ones that would connect to the board).
  • TBGA describes a ball on the top side of the package (ones that would connect to a POP memory)
• PIN_NUMBER: the ball location (either on top or bottom) on the ball grid array
• NET_NAME: the signal name associated with the ball.

The other columns are not relevant. Also, any row designated as U1 is not relevant.

Reading the Spreadsheet

• Any ball without a net name is considered a NC (no connect). Do not connect anything to these balls.
• Any balls labeled NC-XXX-FEED (eg., NC-A1-FEED) are feedthrough signals that should be left as NC on the board, but are feedthrough to the top of the package. Ensure these are NC on the POP memory you are using. To see what signal it connects to on the top of the package, search for the equivalent signal name with a TBGA reference designator (REFDES)

Example:
NC-A20-FEED is the signal for BGA pin A25 and TBGA pin A20. This means that ball A25 on the bottom side of the package is connected to A20 on the top side of the package.

Signals labeled POP-XXX

In general, signals labels starting with "POP" (eg, POP_DDR_VDD-5) are feedthrough signals. These signals must be connected appropriately on the board to get the signals routed correctly to the top side of the package for the POP memory. Some examples follow:

1.  Any balls labeled POP_VDDS_IO-xxx (eg., POP_VDDS_IO-GPMC_A2) are feedthrough pins whose function will be determined by the POP memory you are using.

Example:

The pin AA14(TBGA) is connected to AF16(BGA) (this can be determined because both have signal name POP_VDDS_IO-GPMC_A2). For some POP memories, AA14 is an IO power ball, while other POP memories have AA14 as signal GPMC_A2 (thus we have a dual role net name). If your POP memory needs IO power, then connect AF16 (BGA) to VDDS_IO on the board. This will get IO power to the POP memory appropriately. If your POP memory has GPMC_A2 at AA14, then connect GPMC_A2 (BGA pin H1) to pin AF16 (BGA) on the board to route GPMC_A2 to the POP memory.

Example:

If you search for AE25, you’ll find it is POP_GPMC_A7. A search for POP_GPMC_A7 will reveal that is has a bottom pin (BGA) and a top pin (TBGA). This is a feedthrough pin. If you need A7 for your POP memory at position Y20, you should connect GPMC_A7 (pin E1) to POP_GPMC_A7 (pin AE25).

2. Any balls labeled POP_VDDS_IO-VDDF-x are feedthrough pins whose function will be determined by the POP memory you are using. In this case, it will with be VDDS_IO power, or VDDF (ie, power for the flash memory in the POP). Ensure that you route the correct power rail for your POP memory.

Example: Pin AF5(BGA) is connected to AA6(TBGA) (both have signal name POP_VDDS_IO-VDDF-4). For some POP memories, AA6 is an IO power ball, while other POP memories have AA6 as a power ball for flash memory (thus we have a dual role net name). If your POP memory needs IO power, then connect AF5 (BGA) to VDDS_IO on the board. This will get IO power to the POP memory appropriately. If your POP memory needs flash power at this ball, then connect your flash power on the board to pin AF5(BGA) on the board. Ensure the correct voltage is going to this ball.

3.  Any balls labeled POP_DDR_VDD-X are power balls for DDR memory in the POP. You must connect DDR power to the appropriate BGA ball to get power to the DDR memory in the POP

Example: Searching for POP_DDR_VDD-5 reveals that it is associated with pin A20 (BGA) and pin B16 (TBGA). Ensure that you connect DDR power (1.8V) at pin A20 on the board so that it gets to pin B16 on the POP memory.

4. The ball labeled POP_DPD-F-GPMC_NBE0_CLE is found on pin AF12 (BGA) and on pin AA10 (TBGA). This signal (GPMC_NBE0_CLE) is typically needed for proper NAND functionality. If your POP memory has NAND flash, you would need to connect GPMC_NBE0_CLE (pin K2 BGA) to pin AF12 (BGA) on the board. This will get GPMC_NBE0_CLE up to pin AA10 (TBGA) for the POP memory

5. For TBGA signals that don't start with "POP_", these are connected directly from silicon to the top of the package. You do not need to worry about connecting the signals from the bottom of the package.

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