AM335x Power Consumption Summary

= Overview =

Note: the power consumption data in this Wiki was last collected on May 15, 2013 The AM335x Power Consumption Summary discusses the power consumption for common system application usage scenarios for the AM335x ARM® Cortex™-A8 Microprocessors (MPUs). The metrics contained in this document serve to give users a better understanding of AM335x active power behaviors -- making it easier to determine a suitable configuration to meet a given power budget. Power consumption is highly dependent on the individual user’s application; however, this document focuses on providing several AM335x application-usage case scenarios and the environment settings that were used to perform such power measurements. This collection of real power measurements was measured on an AM335x GP EVM with a high-precision digital multimeter. For additional details about the AM335x processor, please visit the TI.com product page.

Power Measurement Setup
The power measurements have been performed on the following platform:


 * Texas Instruments AM335x 15x15 GP EVM
 * Base Board Revision : 1.2A ("DDR2")
 * Base Board Revision : 1.5A ("DDR3")
 * General Purpose Daughterboard Revision : 1.2B
 * LCD Board Revision : 1.3A

Base Board SW3 settings

Base Board SW4 settings


 * Keithley 2701 DMM with a 7702 40-channel mux module.
 * All tests were not conducted in a controlled environment. The ambient room temperature was ~25C.

AM335x Power Supplies
The following table describes the power supplies for AM335x:

* Note: These voltage rails are not available in the 13x13 package.

The "DDR3" measurements have an additional "VDDSDDRMEM" supply, which is brought up on the Rev1.5A GP EVM. This is not an AM335x voltage rail. It is used to measure the power consumption of the dual-loaded DDR3 + VTT.

= High-level Summary =

The following tables contain a high-level summary of the total device power (measured in milliwatts) for each application use case and/or configuration. For a detailed breakdown of the total device power over all 20 supplies, click on the corresponding link in the table cells. An Excel spreadsheet of the data can be downloaded here: [[Media:AM335x_PowerConsumptionSummary_20130515.zip]]

Low Power Modes
Implemented in StarterWare. "Max" accounts for additional leakage power due to worst-case silicon process variation, at room temperature.

Active Power
Selected demo applications from the AM335x EVM SDK 05.07
 * VDD_CORE and VDD_MPU at OPP100 (ARM 600 MHz, L3 200 MHz, L4 100 MHz)
 * "DDR3" refers to AM335x Rev. 1.5A GP EVM, which has dual-loaded DDR3 with VTT termination at running 303 MHz
 * "DDR2" refers to AM335x Rev. 1.2A GP EVM, which has dual-loaded DDR2 running at 266 MHz

MPU DVFS
Dynamic Voltage Frequency Scaling (DVFS) for the MPU voltage domain. VDD_CORE is maintained at OPP100.

VDD_MPU Power vs. Total Device Power Consumption (DDR3 EVM)

CORE OPP
CORE OPP for the VDD_CORE voltage domain.

= Low Power Modes =
 * As implemented in Starterware
 * Rev1.5A GP EVM
 * "Typical" refers to nominal PG2.x silicon, at room temperature
 * "Max" accounts for additional leakage power due to worst-case silicon process variation, at room temperature
 * This version of DS1 does not include USB remote wakeup

Standby
= Active Power =
 * Selected demo applications from the AM335x EVM SDK 05.07
 * VDD_CORE and VDD_MPU at OPP100 (ARM 600 MHz, DDR3 303 MHz, L3 200 MHz, L4 100 MHz)
 * Optimized IO pad configuration
 * SmartReflex disabled
 * Matrix GUI is shutdown (except for "OS Idle")
 * LCDC is disabled (except for "OS Idle", "H.264 Decode", "Mpeg4 + AAC Decode", "3D Chameleon Man")

Linux PSP
Use Case: Command prompt after login, no application running

OS Idle
Use Case: Matrix Qt GUI

Dhrystone

 * Measured DMIPS/MHz : 1.8 ~ 1.9 DMIPS/MHz

3D Chameleon Man
= MPU DVFS =
 * Updated OPP voltage/frequency table for PG2.x
 * VDD_CORE kept at OPP100
 * Optimized IO pad configuration
 * SmartReflex disabled
 * Matrix GUI is shutdown (except for "OS Idle")
 * LCDC is disabled (except for "OS Idle", "H.264 Decode", "Mpeg4 + AAC Decode", "3D Chameleon Man")

Nitro
= CORE OPP =


 * Please be aware of the limitations and advisories for using OPP50, as specified in the Datasheet and Silicon Errata.
 * CORE OPP50 configured in uboot
 * Optimized IO pad configuration
 * SmartReflex disabled
 * Matrix GUI is shutdown (except for "OS Idle")
 * LCDC is disabled (except for "OS Idle", "H.264 Decode", "Mpeg4 + AAC Decode", "3D Chameleon Man")

CORE OPP100
= Additional Power Savings =
 * Disabling unused modules (USB, Ethernet, etc.)
 * Minimizing frequencies (MPU, interconnect, DDR)

= References =
 * AM335x Datasheet
 * AM335x Technical Reference Manual
 * AM335x Silicon Errata
 * AM335x PM User Guide
 * StarterWare PM
 * Standby Users Guide
 * AM335x Evaluation Module
 * GP EVM User Guide
 * GP EVM Design Files
 * Linux SDK for TI ARM MPU
 * AM335x Thermal Considerations. As IC components become more integrated and more complex, the challenge of producing an end product with good thermal performance also increases. Thermal performance is a system level concern, impacted by IC packaging as well as PCB design. This application note addresses the thermal considerations for the AM335x devices.
 * Optimizing AM335x IO Power in DeepSleep0
 * AM335x Power Measurement Archive