AM57x Hardware Design Guide

Hardware Design Timeline →

 * The TMDXEVM5728 EVM is always a good source from which to start building a reference design for these devices. The technical documentation for this EVM are available.


 * The links at the TI website below provide block diagrams, application notes, tools, software, design considerations, and other related information for various products under category "Related End Equipments".
 * AM574x Product Folder
 * AM572x Product Folder
 * AM571x Product Folder
 * AM570x Product Folder


 * The AM574x/AM572x/AM571x Compatibility Guide covers the differences in ball assignment, pin multiplexing and basic features between AM574x, AM572x, and AM571x.


 * Select from a list of complementary devices to attach to AM57x device in your system:
 * AM574x Power Management Device (required): TPS659037
 * AM572x Power Management Device (required): TPS659037
 * AM571x Power Management Device (required): TPS659037 or TPS65916

Selecting the Boot Mode
The block diagram should also indicate which interface will be used for booting this device.


 * These devices contain an on-chip ROM Bootloader:
 * The boot config pins are sampled at power-on-reset
 * Sets up system for boot depending on boot configuration selected
 * Depending on boot mode, copies image to internal RAM and then executes it
 * Maximum size of the boot image is 504 KBytes
 * The following boot modes are supported:
 * NOR Flash boot
 * NAND Flash boot
 * SD boot
 * eMMC boot
 * QSPI_1 boot (1-bit SPI flash memories)
 * QSPI_4 boot (4-bit (Quad) SPI flash memories)
 * SATA boot
 * UART boot
 * HS USB 2.0 boot (like an ethernet card, not as mass storage)
 * If the first boot source fails to boot, the ROM will move on to the next one in the sequence. Keep in mind that some boot sources take some time to timeout if that boot source isn't available.
 * Read AM574x Technical Reference Manual, AM572x Technical Reference Manual, or AM571x Technical Reference Manual Initialization Chapter to understand details on different boot modes


 * Key Boot Considerations:
 * It is recommended to include population options for other boot modes to aid in development
 * Boot pins have other functions after reset. Make sure your board design takes this into account when choosing pullup/down resistors for the boot pins.

Confirming Pin Multiplexing Compatibility
The AM57x device contains many peripheral interfaces. In order to reduce package costs while maintaining maximum functionality, many of the AM57x terminals can multiplex up to 16 signal functions. Some background about the AM57x pin-multiplexing:
 * Although there are many combinations of pin-multiplexing that are possible, only a certain number of sets, called IO sets, are valid due to timing limitations. These valid IO sets were carefully chosen to provide many possible application scenarios for the user.
 * In order to guarantee the IO timings published in the AM57x Data Manual over the lifetime of the device, AM57x software must implement the proper pin configuration requirements. These requirements impact software configuration of the following registers and are fully documented in the Pad Configuration Section of the AM57x TRM.
 * Pad Configuration Registers (i.e. muxmode, slew control, Virtual IO Timing Modes, etc)
 * IODELAYCONFIG Registers (i.e. Manual IO Timing Modes)

Texas Instruments has developed a Windows/Linux application called the TI PinMux Tool that helps a system designer select the appropriate pin-multiplexing configuration for their AM57x based product design. This tool provides a way to select valid IO Sets of specific peripheral interfaces to insure the pin-multiplexing configuration selected for a design only uses valid IO Sets supported by AM57x. Additionally, it also provides generated output files to help software correctly implement the pad configuration requirements necessary for guaranteeing the device's IO timings. These generated files are named with the prefix "boardPadDelay."
 * TI PinMux Tool

Confirming Electrical and Timing Compatibility
A key step in the hardware design before beginning schematic capture is to confirm both DC and AC electrical compatibility between this device and the other ICs connected to it.


 * The device datasheet has important information with regards to timing and electrical characteristics.
 * For High Speed Interfaces you can run IBIS simulations using IBIS models provided for AM57xx ABC package to confirm signal Integrity.
 * ABC Package IBIS [TBD]


 * Using IBIS Models for Timing Analysis


 * Note: TI provides PCB layout specifications for the following interfaces, eliminating the need to perform electrical analysis:
 * DDR3/DDR3L - See Datasheet (precludes timing analysis)
 * USB, HDMI, SATA, PCIe - See the High-Speed Interface Layout Guidelines application report (SPRAAR7)

Designing the Power Subsystem
Once the block diagram has been validated for pin multiplexing, electrical, and timing compatibility, the power sub-system can be designed.

Texas Instruments requires that the following PMIC (or Power Management IC) be used with AM57x designs:
 * AM574x Power Management Device (required): TPS659037
 * AM572x Power Management Device (required): TPS659037
 * AM571x Power Management Device (required): TPS659037 or TPS65916

Note that both the TPS659037 and TPS65916 PMICs require an external 16.384MHz crystal. See the below resources on estimating power consumption and designing a AM57x + PMIC solution.


 * AM57x Power Consumption Summary: The AM57x Power Numbers discusses the power consumption for common system application usage scenarios for the AM57x Sitara™ Processors. Power consumption is highly dependent on the individual user’s application; however, this document focuses on providing several AM57x application-usage case scenarios and the environment settings that were used to perform such power measurements.
 * AM574x Power Estimation Tool, AM572x Power Estimation Tool, and AM571x Power Estimation Tool: The Power Estimation Tool (PET) provides users the ability to gain insight in to the power consumption of select Sitara processors. The tool includes the ability for the user to choose multiple application scenarios and understand the power consumption as well as how advanced power saving techniques can be applied to further reduce overall power consumption.


 * TPS659037 (AM572x Power Solution) Data Sheet
 * TPS659037 User’s Guide to Power AM572x and AM571x (SLIU011)

Designing the Clocking Subsystem
In addition to the power subsystem, the clocking subsystem needs to be designed to provide appropriate clocks to all ICs in the system. These clocks can be created by pairing crystals with internal oscillators within the system ICs, or they can be created by a separate clock generator. See the below information on designing the clocking subsystem for your design.


 * Key Considerations:
 * The device operation requires the following clocks:
 * A 32k optional crystal as an optional clock source for the RTC.
 * Two HF crystals, SYS_CLKIN1 (Mandatory with either 19.2,20,27 MHz) and SYS_CLKIN2 (Optional with 19.2-32MHz quartz or 12-38.4MHz CMOS square clock source), reference clocks for system operation.
 * For more details, please refer to the Clocking sections of the device datasheet and TRM.

Analyzing Thermal Management Requirements
The product design cycle should include thermal analysis and thermal management techniques to ensure the operating junction temperature of the device is within functional limits.


 * Power and Thermal Design Considerations Using TI's AM57x Processor Reference Design
 * AM57x Thermal Considerations (wiki)

Floorplanning the PCB
Before beginning schematic capture, it is recommended to floorplan the system PCB to determine the interconnect distances between the various system ICs.

Creating the Schematics
At this point in the design, it is time to start capturing the schematics. See the below collection of information to aid you in creating the schematics.


 * Key Considerations:
 * Output clocks that are internally looped back
 * Don’t forget to install a JTAG connection
 * JTAG: Make sure to use the RTCK pin


 * It is often helpful to refer to example schematics throughout the schematic capture process: [TBD]
 * Make sure to use the canned schematics in the datasheet for the following interfaces:
 * DDR3/DDR3L
 * For detailed information on USB, HDMI, SATA, and PCIe board design, see the High-Speed Interface Layout Guidelines application report (SPRAAR7)
 * During and after schematic capture, check your design against the schematic checklist:
 * Schematic Checklist
 * Plan to have an internal schematic review to go through the schematic checklist and inspect other key areas of the schematic to look for inaccuracies, missing net connections, etc.

Below are Symbols, Footprints, and Simulation Models to aid in the design of the device placement and interconnects:


 * OrCad Symbols
 * Altium Symbols
 * Allegro footprints
 * Pin Names and Numbers
 * AM574x: Available in Data Sheet in
 * AM572x: Available in Data Sheet in
 * AM571x: Available in Data Sheet in
 * AM570x: Available in Data Sheet in


 * BSDL Simulation Model


 * IBIS Simulation Models


 * General hardware design information:AM57x BGA PCB Design
 * For selecting and placing decoupling capacitors in a BGA design:
 * Decoupling (Bypass) Capacitor Selection and Placement for BGAs

Laying out the PCB
After completing schematic capture, see the below information on laying out the PCB:


 * It is often helpful to refer to an example layout when designing a custom PCB: [TBD EVM Layout]
 * Make sure to follow the Layout Specifications for the following Critical Interfaces:
 * DDR3/DDR3L - See Datasheet
 * USB, HDMI, SATA, PCIe - See the High-Speed Interface Layout Guidelines application report (SPRAAR7)


 * Plan to have an internal PCB layout review with your design team to verify that net connection traces and the power distribution network were created correctly.


 * General Information Articles:
 * Understanding TI's PCB Routing Rule-Based DDR Timing Specification
 * AM57xx BGA PCB Design
 * AM57x PDN app note

Board Bringup/Diagnostic
Once your custom PCB has been produced and assembled, refer to the below information on bringing-up and debugging the system.


 * Overview of Debug and Trace Tools
 * Code Composer Studio
 * Using BSDL to validate AM57x based board
 * You can use AM57x BSDL files to validate the connectivity on board build.
 * Processor SDK RTOS Diagnostics