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CC256x Overview

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CC256x offers combinations of Bluetooth, BLE to add connecitivity to your application. The information below describes both the CC2564C, CC2564B and CC2560B overview information.


TI's CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI's 7th generation Bluetooth core, the device brings a product-proven solution that supports Bluetooth dual mode.

NoteNote: More in-depth information and guides are available at CC256x's Wiki.

Initial Screen of A3DPDemo application


  • TI's Single-Chip Bluetooth® Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support
  • Bluetooth 4.2 Component Qualified (Declaration ID: D032801); Compliant up to the HCI Layer
  • Highly Optimized for Size-Constrained and Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm × 8-mm (VQFNP-MR)
  • BR and EDR Features Include:
    • Up to Seven Active Devices
    • Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
    • Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
    • Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, Modified Subband Coding (mSBC), and Transparent (Uncoded)
    • Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
    • Support of Multiple Bluetooth Profiles With Enhanced QoS
  • Low Energy Features Include:
    • Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
    • Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
    • Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
    • Capabilities of Link Layer Topology Scatternet—Can Act Concurrently as Peripheral and Central
    • Network Support for up to 10 Devices
    • Time Line Optimization Algorithms to Achieve Maximum Channel Utliization
  • Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power up to +12 dBm
    • Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
    • Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
  • Advanced Power Management for Extended Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct Connection to Battery
    • Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power Consumption
  • Physical Interfaces:
  • UART Interface With Support for Maximum Bluetooth Data Rates
    • UART Transport Layer (H4) With Maximum Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
    • Fully Programmable Digital Pulse-Code Modulation (PCM)–Inter-IC Sound (I2S) Codec Interface
  • Flexibility for Easy Stack Integration and Validation Into MCUs and MPUs
  • CC256x Bluetooth Hardware Evaluation Tool:
  • PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

CC256x Supported Technologies

Device Technology Supported Software Engagment

CC2564C Bluetooth + Bluetooth Low Energy(BR/EDR/LE)
  • Royalty free Bluetooth stack
  • Classic Bluetooth and GATT based profiles and samples from TI

Bluetooth + Bluetooth Low Energy(BR/EDR/LE)
  • Royalty free Bluetooth stack
  • Classic Bluetooth and GATT based profiles and samples from TI
CC2560B Bluetooth (BR/EDR)
  • Royalty free Bluetooth stack
  • Classic Bluetooth profiles and sample apps from TI.

Bluetooth Current Consumption

The following shows the different modes and the associated current consumption of each.

Mode Current Consumption
Sleep 40µA
GFSK full throughput: TX = DH1, RX = DH5 38.4mA
EDR full throughput: TX = 2-DH1, RX = 2-DH5 39.2mA
EDR full throughput: TX = 3-DH1, RX = 3-DH5 39.2mA
Sniff, one attempt, 1.28 seconds 76 and 100µA
Page or inquiry scan 1.28 seconds, 11.25 ms 300µA
Page (1.28 seconds) and inquiry (2.56 seconds) scans, 11.25 ms 430µA

TI's Offering: Development Tools

CC2560 and CC2564 Modules

CC256x QFN & CC2564MODx Characteristics
Part Numbers (orderable through TI and distribution)
  • CC2564C  : BT 4.2 Dual mode (BT + BLE or Assisted Audio)
  • CC2564MODA  : BT 4.1 Dual mode (BT + BLE or Assisted Audio) certified module with integrated antenna
  • CC2564MODN  : BT 4.1 Dual mode (BT + BLE or Assisted Audio) certified module
  • CC2564B  : BT 4.0 Dual mode (BT + BLE or Assisted Audio)
  • CC2560B  : BT 4.0 Classic Bluetooth
  • CC2560B/CC2564B/CC2564C Devices (QFN package) 8.0 x 8.0 x 0.6 mm
  • CC2564MODA (MOG package) 7.0 x 14.0 x 1.4 mm
  • CC2564MODN (MOE package) 7.0 x 7.0 x 1.4 mm
  • QFN Design 16.5 x 16.5 mm
Tempature Range
  • CC2560B/CC2564B/CC2564C QFN Devices : -40C to +85C
  • CC2564MODA/CC2564MODN modules : -30C to +85C
Tx Power max
  • CC2560B/CC2564B/CC2564C QFN Devices : +12dBm
  • CC2564MODA/CC2564MODN modules : +10dBm (EDR)
Rx Sensitivity
  • CC2560B/CC2564B/CC2564C QFN Devices : -95dBm
  • CC2564MODA/CC2564MODN modules : -93dBm
IC Certification BT SIG
Reference Layout EM Board, 2 layers
Reference Antenna Printed PCB Antenna

Chip Antenna (CC2564MODN)
Integrated Chip Antenna (CC2564MODA)

EM Certification FCC, IC, CE


TI’s Bluetooth Stack

  • Core TI’s Bluetooth stack library, specific profile libraries, API headers and API documentation.
  • Platform specific sources files and headers
  • Sample applications that can be used to exercise the Bluetooth functions and the provided profiles.
  • Project files for various build environments and IDEs.

Stonstreet One Bluetooth Software Stack
Protocol Communication
  • Bluetooth 4.2 for CC2564C
  • Bluetooth 4.0 for CC256xB
Single Mode - Bluetooth Bluetooth - SPP profile and sample apps
Dual Mode - Bluetooth + BLE BLE- GATT Profile/sample app; ANS, ANP, DIS, HTP, HTS, HRP, HRS, PASP
Hardware supported Works with TI devices and 3rd Party Module solutions
Tool Chains supported IAR and CCS
OS No OS, scheduler
MCU supported Various MSP43X devices – 96k flash and up
Download TI’s Bluetooth Stack

Bluetooth and BLE Profiles

  • Bluetooth classic profiles
    • Each profile represents a Bluetooth user model that describes a number of user scenarios where Bluetooth performs a radio transmission.
    • Serial Port Profile – standard profile for data transfer.
    • Profiles to transfer audio – A2DP, AVRCP.
    • MFi capability available upon request.
    • Bluetooth classic profiles typically meet SIG specifications (vs making proprietary profiles).
  • Bluetooth low energy profiles are lightweight
    • Easy for anyone to create a new profile.
    • Profiles typically require minimal memory resources.
    • Proprietary profiles can be adopted/interpreted and created from standard profiles provided.
  • Bluetooth low energy profiles are reusable
    • Include services from existing profiles provided.
    • Extend profiles provided with the features you need.

Sample Code, Demo, and Utilities

Sample Application and Demo source is available in the Sample Code and Demos Downloads page. Utilities such as the Bluetooth Hardware evaluation tool can be found in the Software section of the CC256x Wiki page.