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OMAP3 AM35x AM/DM37x FAQ From Field

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HW FAQ[edit]

NAND芯片选型[edit]

客户经常会遇到NAND芯片选型的问题。

  • 所选的NAND是否是OMAP3xxx/AM3xxx/DM37xx的ROM CODE支持的NAND, 不然无法从NAND启动。OMAP3xxx/AM3xxx/DM37xx ROM CODE支持的NAND的类型见NAND devices supported on OMAP3。 简单的说,就是看NAND的Device ID(也有芯片厂商标注为Device Code)是否是在下面的表里面。比如:某款4Gb(x16)NAND的Device Code是0xBC, 是ROM CODE可以识别的NAND类型。
0xF1 0xB1 0xC1 0xAA 0xDA 0xBA 0xCA 0x36 0x76 0x46 0x56 0x35 0x75 0x45 0xF5 0x55 0x33 0x73
0x43 0x53 0xE3 0xE6 0x79 0x78 0xA1 0x72 0x74 0xAC 0xDC 0xBC 0xCC 0xA3 0xD3 0xB3 0xC3 0xA5
0xD5 0xB5 0xC5 0xA2 0xF2 0xB2 0xC2 0x39 0x49 0x59
  • 除了检查ID之外,还需要检查ECC level(1bit ECC/512Byte, 4bit ECC/512Byte or more)。我们的软件目前是支持1bit ECC/512Byte。对于多个ecc纠错的情况,比如:4bit ECC/512Byte,正在开发和测试。(关于ECC的进一步介绍可以参见GPMC_ECC。)
  • 对于OMAP3xxx/DM37xx,NAND接口是1.8V电平; 对于AM3xxx,可以支持1.8V/3.3V两种电平设置。使用电平不匹配的NAND,需要在中间加电平转换芯片。
  • 对于OMAP3xxx/DM37xx的POP封装,可以支持POP的NAND+mDDR。这种组合可以节省PCB的面积,但是对PCB(0.4mm pitch走线)和生产(POP封装的贴片)要求高,会增加成本。主要是手机上使用这种组合。一般应用中,OMAP3xxx/DM37xxx使用0.65mm封装,NAND和mDDR使用非POP的封装,比如:137 Ball 0.8mm pitch FBGA封装。

如何实现双LCD显示的支持[edit]

对于OMAP35XX, AM35X, AM/DM37X, 可以通过如下方式来实现对双LCD显示的支持:

  • 数字RGB接口+TV模拟接口的方式:对于OMAP35XX, AM35X, AM/DM37X, 有数字RGB LCD和模拟TV的两路独立输出(所谓独立,是指显示内容可以完全不同)。数字RGB LCD接口一路可以直接连LCD屏(具体连接方式请参考LCD_connectivity)。而模拟TV接口可以连接支持TV(CVBS或S-VIDEO)输入的LCD屏,或者通过视频解码芯片将模拟信号转换为数字信号,再输出给数字接口的LCD。这种方法是使用最多的,并且现有的软件也可以支持。
  • 通过外加逻辑的方式,将LCD输出的高分辨率的RGB信号进行降频使用。比如:LCD输出的1600*480,PCLK@50MHz的信号;通过外部的逻辑,将这个信号分解为800*480 PCLK@25MHz+ 800*480PCLK@25MHz的两路信号,其中第一路为每一行的0..799,第二路为800.1599点。如此实现双LCD的显示。这种方法需要外加逻辑电路。
  • LCD接口工作在RFBI工作模式,外接两个带有FRAME BUFFER(GRAM)的LCD屏。这种方法对屏的选择有要求,并且现有的软件无法支持,不推荐使用。

如何实现对DVI和HDMI的支持[edit]

OMAP35XX、AM/DM37X的EVMAM35X的EVM上,已经有支持DVI的参考电路。对HDMI,主要是在DVI的基础上增加对音频的支持。这一点可以通过将OMAP35X/AM/DM37X, AM35X的McBSP2(工作在I2S模式)接口与HDMI芯片互连来实现。关于HDMI芯片,SIL9022和OMAP35X、AM/DM37X互连过, 请参考OMAP_MDP

Linux FAQ[edit]

Android FAQ[edit]

WINCE FAQ[edit]

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